Wikichip.org recives any estimated n/a unique visitors and n/a unique page views per day. Revenue gained from these much visits may be n/a per day from various advertising sources. The estimated worth of site is n/a.
- Website Age
n/a
- Alexa Rank no-data
- Country
United States
- IP Address
3.234.104.255
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HTML SIZE INFORMATION
Text / Code Ratio
10.11 %
wikichip.org has a website text/code ratio of 10.11 %. Search engine crawlers tend to not pick up pages with inadequate content.
IMPORTANT HTML TAGS AND COUNTS
Titles
- H10
- H216
- H30
- H40
- H522
- H60
H2
No |
Text |
1 |
Latest coverage: [ıedm] [ısscc] [vlsı] [hot chips] |
2 |
Arm’s new cortex-m55 breathes helium |
3 |
ıntel launches lakefield: an experiment with multiple new technologies |
4 |
Arm unveils the cortex-a78: when less ıs more |
5 |
Arm cortex-x1: the first from the cortex-x custom program |
6 |
ıbm releases power ısa v3.1; to present power10 at hot chips 32 |
7 |
Left, right, above, and under: ıntel 3d packaging tech gains omnidirectionality |
8 |
Nec readies 2nd gen vector engine |
9 |
Tsmc to build a 5-nanometer fab ın arizona; ınvest $12b over the next 8 years |
10 |
ıntel launches 10th gen comet lake vpro processors |
11 |
ıntel launches entry-level comet lake xeon ws |
12 |
Amd launches ryzen pro 4000 series |
13 |
ıntel launches 10th gen comet lake desktop processors |
14 |
Tsmc ramps 5nm, discloses 3nm to pack over a quarter-billion transistors per square millimeter |
15 |
Ranovus odin: co-packaging next-gen dc switches and accelerators with silicon photonics |
16 |
A look at ıntel lakefield: a 3d-stacked single-ısa heterogeneous penta-core soc |
H5
No |
Text |
1 |
Wikichip |
2 |
The fuse coverage |
3 |
Social media |
4 |
Companies |
5 |
Microarchitectures |
6 |
Technology nodes |
7 |
ıntel (2) |
8 |
Amd (2) |
9 |
Arm |
10 |
Cavium (2) |
11 |
Samsung (2) |
12 |
Ampere |
13 |
Apple |
14 |
Hisilicon |
15 |
Mediatek |
16 |
Nxp |
17 |
Qualcomm |
18 |
Renesas |
Text Styling
- STRONG0
- B6
- EM0
- I1
- U0
- CITE0
B
No |
Text |
1 |
WikiChip |
2 |
µArchs: |
3 |
x86 SoCs: |
4 |
ARM SoCs: |
5 |
Specialized SoCs: |
6 |
Other Topics: |
I
No |
Text |
1 |
Statistics for month of June, 2019. |
LINK ANALYSIS
Total Link Count: 356
Internal Link Count
: 324
No |
Text |
Type |
1 |
WikiChip |
text |
2 |
WikiChip |
text |
3 |
Home |
text |
4 |
Random Article |
text |
5 |
Recent Changes |
text |
6 |
Chip Feed |
text |
7 |
Intel |
text |
8 |
AMD |
text |
9 |
ARM |
text |
10 |
Qualcomm |
text |
11 |
Skylake (Client) |
text |
12 |
Skylake (Server) |
text |
13 |
Zen |
text |
14 |
Coffee Lake |
text |
15 |
Zen 2 |
text |
16 |
Technology Nodes |
text |
17 |
14 nm |
text |
18 |
10 nm |
text |
19 |
7 nm |
text |
20 |
Architectures |
text |
21 |
Skylake |
text |
22 |
Kaby Lake |
text |
23 |
Coffee Lake |
text |
24 |
Ice Lake |
text |
25 |
Skylake |
text |
26 |
Cascade Lake |
text |
27 |
Cooper Lake |
text |
28 |
Ice Lake |
text |
29 |
Sunny Cove |
text |
30 |
Willow Cove |
text |
31 |
Goldmont |
text |
32 |
Goldmont Plus |
text |
33 |
Tremont |
text |
34 |
Gracemont |
text |
35 |
Zen |
text |
36 |
Zen+ |
text |
37 |
Zen 2 |
text |
38 |
Zen 3 |
text |
39 |
Neoverse N1 |
text |
40 |
Zeus |
text |
41 |
Cortex-A75 |
text |
42 |
Cortex-A76 |
text |
43 |
Cortex-A77 |
text |
44 |
Cortex-A53 |
text |
45 |
Cortex-A55 |
text |
46 |
Vulcan |
text |
47 |
Exynos M1 |
text |
48 |
Exynos M2 |
text |
49 |
Exynos M3 |
text |
50 |
Exynos M4 |
text |
External Link Count
: 32
No |
Text |
Type |
1 |
The Fuse Coverage |
text |
2 |
Recent News |
text |
3 |
ISSCC |
text |
4 |
IEDM |
text |
5 |
VLSI |
text |
6 |
Hot Chips |
text |
7 |
SuperComputing |
text |
8 |
Twitter |
text |
9 |
Flipboard |
text |
10 |
- |
image |
11 |
Latest |
text |
12 |
[IEDM] |
text |
13 |
[ISSCC] |
text |
14 |
[VLSI] |
text |
15 |
[Hot Chips] |
text |
16 |
Arm’s New Cortex-M55 Breathes Helium |
text |
17 |
Intel Launches Lakefield: An Experiment With Multiple New Technologies |
text |
18 |
Arm Unveils the Cortex-A78: When Less Is More |
text |
19 |
Arm Cortex-X1: The First From The Cortex-X Custom Program |
text |
20 |
IBM Releases Power ISA v3.1; To Present POWER10 At Hot Chips 32 |
text |
21 |
Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality |
text |
22 |
NEC Readies 2nd Gen Vector Engine |
text |
23 |
TSMC To Build A 5-Nanometer Fab In Arizona; Invest $12B Over The Next 8 Years |
text |
24 |
Intel Launches 10th Gen Comet Lake vPro Processors |
text |
25 |
Intel Launches Entry-Level Comet Lake Xeon Ws |
text |
26 |
AMD Launches Ryzen Pro 4000 Series |
text |
27 |
Intel Launches 10th Gen Comet Lake Desktop Processors |
text |
28 |
TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter |
text |
29 |
Ranovus Odin: Co-Packaging Next-Gen DC Switches and Accelerators With Silicon Photonics |
text |
30 |
A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC |
text |
31 |
See more... |
text |
32 |
Twitter Link |
text |
Nofollow Link Count
: 2
No |
Text |
Type |
1 |
Twitter |
text |
2 |
Flipboard |
text |
Title Link Count
: 0
WEBSITE SERVER INFORMATION
- Service Provider (ISP)
- Amazon Technologies Inc.
- Hosted IP Address
- 3.234.104.255
- Hosted Country
United States
- Host Region
- Virginia , Ashburn
- Latitude and Longitude
- 39.0438 : -77.4874
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